The DPC process for producing ceramic substrates involves the use of semiconductor manufacturing techniques to create a substrate with a copper layer plated directly onto its surface. The following steps are involved in the DPC process:
- Preparation of the substrate: Appropriate raw materials for ceramic substrates are selected, and they are cut and ground to obtain a flat, smooth surface.
- Cleaning of the substrate: The prepared substrate is cleaned to remove any impurities or dirt from the surface.
- Deposition of copper seed layer: A copper seed layer is deposited on the cleaned substrate surface using semiconductor manufacturing techniques. This is typically done through physical vapor deposition (PVD), which uses high-energy ions to deposit a thin copper film onto the surface of the substrate to form the seed layer.
- Photolithography: Photolithography techniques are used to define the desired shapes and structures to be made on the substrate. A photolithography photoresist is applied to the substrate surface, and the desired pattern is transferred to the copper seed layer surface using exposure and development steps.
- Acid etching: The exposed copper seed layer is acid-etched to remove unwanted copper layers.
- Electroplating: After the photolithography and etching steps, the substrate is electroplated to directly deposit copper onto the surface of the substrate. This process creates the required circuitry and interconnections by forming copper layers on the areas where copper is required.
- Shaping and finishing: The substrate is shaped and finished to obtain the desired dimensions and shape. This process can involve polishing and smoothing to further improve surface quality and flatness.
The DPC process for ceramic substrates is a highly effective way of producing high-quality substrates with a copper layer plated directly onto the surface. This process finds wide application in various electronic and electrical fields, such as semiconductor manufacturing and circuit board manufacturing.
